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FREMONT, Calif., May 07, 2019 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an initial order from a new customer for its FOX-CP TM single-wafer test and burn-in system. This new lost-cost compact system will be used to perform 100% test and burn-in of the customer’s new device for high-volume production over a multi-year ramp of products in the enterprise and data center market.
The over $1.2 million order includes a FOX-CP System configured with 2,048 independent universal test resources, multiple proprietary high-power WaferPak contactors, and an integrated high power and fully automated high force chuck wafer prober. The shipment is expected during the second calendar quarter of 2019. The customer forecasts additional FOX-CP systems to be delivered to multiple locations worldwide where Aehr Test will support the turnkey solution directly with Aehr Test personnel.
Gayn Erickson, President and CEO of Aehr, commented, “We are delighted to begin this relationship with this major new customer for our FOX-CP system for 100% test and burn-in of devices, versus sampling, that will be used in a very high-volume application for the Enterprise and Data Center market, with a build out of this production ramp over the new several years. IDC, a global provider of market intelligence for the information technology, telecommunications, and consumer technology markets, recently released a report forecasting that the collective sum of the world’s data will grow from 33 zettabytes in 2018 to 175 zettabytes by 2025, for a compounded annual growth rate of 61 percent. A zettabyte is one trillion gigabytes. We see the data storage market, as well as multiple devices related to the worldwide 5G build-out, as critical new opportunities for our systems, where these end markets and customers require devices to have extremely high levels of quality and long-term reliability.”
The FOX-CP single-wafer test system reduces test cost by functionally testing wafers during reliability screening to identify failing logic, memory and photonic die before integration into their final package. This integrated test system, with wafer handling and stepping capabilities, utilizes Aehr’s custom FOX WaferPak™ contactor and wafer prober with thermal chucks to support a wide range of wafer power requirements. Key features of the FOX-CP include:
Aehr’s FOX-P platform is the company’s next-generation multi-wafer and singulated die/module test solution that is capable of functional test and burn-in/cycling of photonics devices, flash memories, microcontrollers, sensors, and other leading-edge ICs before they are assembled into single or multi-die stacked packages. The FOX-P family of test and burn-in low cost small foot print configurable products includes the FOX-CP single-wafer system, FOX-NP 2 wafer system and FOX-XP 18 wafer system. The FOX-P wafer-level systems utilize Aehr’s FOX WaferPak contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The configuration with the DiePak® Carriers enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die (KGD), single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors.
The key features of the FOX-P platform that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 “Universal Channels” per wafer or DiePak carrier, which allows the system to test all the devices on the wafer or DiePak carrier in parallel. The innovative “Universal Channel” architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 blades of wafer test resources, enabling up to 18 wafers to be tested simultaneously. The footprint of the 18-wafer FOX-XP test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time. The highly integrated 2-blade FOX-NP system has a very small footprint and is designed to be easily integrated into product design, reliability and test lab applications. The new FOX-CP single-wafer system is integrated with a wafer prober and performs wafer-level testing and reliability screening.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTSTM and FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Aehr as of the date hereof and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements include statements regarding Aehr’s expectations, beliefs, intentions or strategies regarding its products, including statements regarding future market opportunities and conditions, expected product shipment dates and customer orders or commitments. These risks and uncertainties include, without limitation, customer demand and acceptance of Aehr’s products, the ability of new products to meet customer needs or perform as described, as well as general market conditions and Aehr’s ability to execute on its business strategy. See Aehr’s recent 10-K, 10-Q and other reports from time to time filed with the Securities and Exchange Commission for a more detailed description of the risks facing Aehr’s business. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.
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